AMD Phenom X3 8750 CPU Review :: AMD Phenom X3 8000 Processor Features

• L1 cache 128KB per core 64KB data and 64KB shared instruction cache (384KB total)
• L2 Cache 512KB of L2 cache per core (1.5MB total)
• L3 Cache 2MB (Shared)
• Memory Controller Type Integrated 128-bit wide memory controller
• Memory controller speed Up to 1.8GHz with Dual Dynamic Power Management
• Types of memory supported Support for unregistered DIMMS up to PC2 8500 (DDR2-1066)
• HyperTransport 3.0 (2.0GHzx2) One 16-bit/16-bit link@ up to 3.6GHz full duplex
• Total Processor Bandwidth Up to 31.5GB/second bandwidth
• Packaging Socket AM2+ 940-pin organic micro pin grid array
• Fab location: Germany AMD’s Fab 36 wafer fabrication facilities in Dresden
• Process Technology: 65 nanomter DSL SOI (Silicon-on-insulator) technology
• Approximate Transistor count 450 million
• Approximate Die Size 285mm2 (65nm)
• Max Ambient Case Temperature 70 Celsius
• Nominal Voltage 1.05-1.25 Volts
• Max TDP: 95 Watts

AMD takes a different approach to Intel with their multiple core CPUs. While Intel has a Shared L2 cache among two of their cores, AMD has a separate L2 cache for each core. AMD says that that makes their Quad Core Phenoms the first true Quad Core processors. The X3 8750 has three cores with 512KB of L2 cache each core, bringing a total of 1.5MB of L2 cache to the table. This is a far cry from Intel’s 12MB L2 cache Quad Cores but those are in a different price league.

AMD manufactures the X3 8750 in their FAB 36 which is located in Dresden Germany. The 8750 is based upon 65 nanometer Silicon On Insulator (SOI) technology. Intel CPUs have moved on to the next stage with their 45 nanometer process CPUs, but AMD has not released 45 nanometer processors as of yet. The 8750 has 450 million transistors and has a die size of approximately 285 square millimeters.

The memory controller on the AMD Phenom X3 9750 is a 128-bit wide controller providing up to 17GB/second of memory bandwidth with 1066MHz DDR2. DDR2 800MHz and slower speeds are also supported. AMD states they will likely support DDR3 memory in 2009, a full year and a half after Intel released their first DDR3 chipset.

HyperTransport 3.0 is the third generation of the HT protocol that was announced and the Phenom CPUs are the first to support the new standard. HTT 3.0 provides up to 20.8GB/second of bandwidth compared to the 8GB/second of HTT 2.0 found on earlier AMD CPUs. This brings the total bandwidth of the CPU+Memory controller to up to 31.5GB/second.

AMD has released a set of CPUs that they call “Energy Efficient”. These are rated for a maximum TDP of 65W for the EE Athlon CPUs. The 8750 has a TDP of 95W making it a non EE CPU. I’m sure as we go along, we’ll see EE CPUs based upon the Phenom B3 core. For now, 95W is still an excellent maximum power draw for a CPU, as it is the same as earlier AMD CPUs, but with a higher number of cores.

Discuss This Article