|
|
|||||||||||||||||
|
Computer components have progressed to smaller process nodes. At the moment the best die process the video cards use is 80 nanometers. Processors, on the other hand have progressed to the 45 nanometer process (Intel in 2nd half 2007.) AMD has just moved to the 65 nanometer process with their new CPUs. The 4800+ X2 Energy Efficient CPU is based upon AMD's 65 nanometer process. It is manufactured in Dresden Germany at AMD's Fab 36 and has 153.8 million transistors split among two identical CPU cores. The earlier AMD CPUs on 90 nanometer were manufactured at AMD's Fab 30 facility. The wafer size of the 65 nanometer processors are 300mm 2 compared to the 200mm 2 that the 90 nanometer CPU wafers were built on. In June of last year AMD moved to the Socket 940 AM2 platform. The move marked a change from DDR to DDR2 and the move to Dual Core AMD CPUs. The 4800+ EE is designed with 256KB of L1 cache split among the two cores with 64KB of L1 Instruction and 64KB of L1 Data cache for each core and. The 4800+ EE also has 512KB of L2 cache on each core. Intel's Core2 CPUs have shared unified L2 cache.  CPU Thermal Design Power (TDP) is the maximum amount of power the thermal solution in a computer is required to dissipate. The higher the TDP the more power the CPU would draw in a worst case scenario. The standard AMD X2 CPU has TDP of 89W with the higher clocked models consuming up to 125W. The 4800+ Energy Efficient CPU has a TDP of 65W, making this CPU very energy efficient as we'll see in the power consumption tests. Lower TDP means less power required. The clockspeed of the 4800+ Energy Efficient CPU is 2.5GHz, just like the regular 4800+ X2 CPU, but with a lower TDP (65W versus 89W.) Contents: 
|
|
|||||||||||||||
