Coming in a simple formed plastic packet with a paper inset stapled on to hold them in place, as well as display the all of them while providing basic installation instructions (in three languages we might add) and some snazzy Swiftech graphics. Thanks to the compact and sturdy nature of the packaging, these memory sinks will arrive at their destination with minimal damage and cost every time. Enough about the packaging however, as we have the matter of the sinks themselves to address. Each of the eight formed copper Heatsinks measures in at 14x14x14mm, which is just large enough to cover a BGA chip perfectly, as well as low enough not to obscure most aftermarket cooling, whether it's air or water.
On the copper base, 16 short copper columns take the task of dissipating heat in true Swiftech fashion, although with enough space between them to allow for passive dissipation, or to accept any airflow coming from a reference cooler or case fan. On the base of each sink is a premium berquist thermal pad, which Swiftech claims has performance similar to that of thermally bonded Heatsinks. It should be taken to note however, that if the memory chips are not cleaned and the sinks are not perfectly applied, the thermal pad will not adhere to the chip, resulting in loose memory Heatsinks, with the potential of them falling off. With the design and properties of the Heatsinks in mind, let's proceed on to how difficult they were to install and what performance we gained shall we?