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Architecturally not much has changed on the LGA (Land Grid Array) Socket 775 CPU itself. The 3.4GHz Extreme Edition/Prescott 3.6GHz CPUs are the same internally and the changes seen are in the external packaging itself. The first thing you will notice is the CPUs lack of underside pins, as Intel now moves the pins from the bottom of the chip to the ZIF socket interface of the motherboard. This is done in an attempt to eradicate the error of the pins being bent when users unwittingly tried to install the CPU incorrectly. So instead of worry about the CPU you now you have to worry about not bending the pins on the board, or its goodbye working motherboard. The 775 ZIF interface is also designed differently and features a locking mechanism that enables the user to safely remove the heatsink without the CPU remaining attached to the cooling solution. This has happened many times to the unsuspecting shocked user whose thermal grease made a bonding contact between the heatsink and the CPU. This would happen due to the heating/cooling exchange of the thermal grease and its eventual hardening. The CPU would get damaged trying to separate them to the utter frustration of the user.
 Processor Comparison Chart The increased pin count from 478 pins to 775 pins will theoretically enhance the electrical throughput to the CPU. This should allow for lower power leakages and decreased heat output form the CPU core. This could be a highly beneficial aspect to the new platforms as heat, especially in terms of the Prescott CPU has become a very potential hazard zone. Everybody has taken pot shots at AMD for their unconventional naming scheme that uses numbering systems to identify a CPUs nomenclature instead of actual CPU speed. I guess Intel took the if you can't beat them join them position and now their new line of CPUs use a number code for CPU identification, just like AMD. Intel will introduce a full line of LGA 775 processors, starting with the new Celeron D at 2.53 to 2.80 GHz. These CPUs are based on the new 90 nm process, but they do not have the ingredients that make the Intel platform a powerhouse. The missing features are lack of Hyper-Threading technology and a limited 256Kb L2 CACHE, which makes the Celeron a cheap but unattractive CPU for the enthusiast crowd and only appealing to the E-machine type of user.
- Pentium 4 500 Series Processors - P4 560, 550, 540, 530 and 520
- Clock speeds starting at 3.6GHz, 3.4GHz, 3.4GHz, 3GHz, and 2.8GHz
- New .09 micron "Strained SI" manufacturing process
- Improved Hyperthreading Technology
- 1MB on chip, Full Speed L2 Cache
- Increased 16KB L1 Data Cache
- Streaming SIMD Extensions - SSE2 and 13 new SSE3 Instructions
- 31 stage "Hyper Pipelined" Technology for extremely high clock speeds
- 800MHz "Quad Pumped" Front Side Bus
- Rapid Execution Engine - ALU clocked at 2X frequency of core
- 128bit Floating Point/Multimedia unit
- Intel "NetBurst" micro-architecture
- Supported by the Intel i925X and i915 chipsets, with Hyperthreading support
- Intel MMX media enhancement technology
- Memory cacheable to 4 GB of addressable memory space and system memory scalability up to 64 GB of physical memory
- 1.25 - 1.4V operating voltage range
- LGA775 Packaging - Land Grid Array
- 89 - 115 Watts TPD (Thermal Design Power
- Pentium 4 Extreme Edition Processor
- Clock speeds of 3.4GHz and 3.4GHz
- .13 micron manufacturing process
- Hyperthreading Technology
- 512kB on chip, Full Speed L2 Cache
- 8KB L1 Data Cache
- Streaming SIMD Extensions - SSE2 Only
- 20 stage "Hyper Pipelined" Technology
- 800MHz "Quad Pumped" Front Side Bus
- Rapid Execution Engine - ALU clocked at 2X frequency of core
- 128bit Floating Point/Multimedia unit
- Intel "NetBurst" micro-architecture
- Supported by the Intel i925X and i915 chipsets, with Hyperthreading support
- Intel MMX media enhancement technology
- Memory cacheability up to 4 GB of addressable memory space and system memory scalability up to 64 GB of physical memory
- 1.525 - 1.6V operating voltage range
- LGA775 Packaging - Land Grid Array
- 89 Watts TPD (Thermal Design Power)
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