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 Post subject: cheap thermal adhesive
PostPosted: Sat May 11, 2002 5:52 pm 
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ok instead of waiting a couple of weeks to order my artic siler thermal adhesive i wanted to know if i could just combine super glue and artic silver 3.

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PostPosted: Sat May 11, 2002 7:45 pm 
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You could, but I wouldn't recommend it. Super Glue is not known for it's heat transference properties! :P

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 Post subject: Welll
PostPosted: Sat May 11, 2002 8:10 pm 
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They have already combined Artic Silver and Glue.

Its called Artic Silver Epoxy

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PostPosted: Sun May 12, 2002 11:32 pm 
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Yes, but that is an entirely different glue than Super Glue, plus datektrader has already ordered it, he just doesn't want to wait. :roll:

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 Post subject: yeah but
PostPosted: Sun May 12, 2002 11:33 pm 
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Yes but is it the Epoxy version? :D

They make so many different kinds...

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PostPosted: Mon May 13, 2002 7:57 am 
Super glue is Eastman Kodak 910, they used it for straingage application, for many a year. All the properties are known. It is a very thin coating because of its viscosity, but it gets rid of air and the atmospheric pressure force the two parts together, It depends on the atmospheric pressure to glue the parts together. Atmospheric pressure is 14.7 psi, otherwise has no strength to speak about. Anyone peels off what's on their fingers knows.

On the otherhand, Epoxy is very thick, and depends on fillers to conduct heat.

The third type of rubber adhesive is used on chipset heatsink. Which you can test the thickness by twisting the heatsink. Those that can be twisted somewhat, does not cool very well. Some chipset(SIS) is known to fail on Pcchips motherboard. Because they used double sided adhesive tape between heatsink and chipset IC. The adhesive should have been thinned out before application. Thick adhesive means tiny air bubbles in the adhesive. Video chipset also use this system.

We will eventually get this problem put to bed.


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PostPosted: Mon May 13, 2002 8:32 pm 
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so thermal epoxy is different than thermal adhesive :? which is better?

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PostPosted: Tue May 14, 2002 3:00 am 
They all work, the degree of efficiency depends on the temperature of the IC you have to cool?

However, rubber adhesive gets soft when it heats up. The epoxy has to have matched thermal coeffcient of expansion(depending on filler used) so it does not crack the IC, when they both heats up. If both goes up a little from room temperature, nobody cares.

Super glue is an acetate formula. Molecular formula is carbon and hydrogen. Carbon and hydrogen are both good heat conductors.


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PostPosted: Tue May 14, 2002 7:11 am 
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:arrow: :idea: super glue is CA glue- CyanoAcrylate- any model builder is familiar w/ this adhesive, as well as epoxy. epoxies can be composed of aliphatic (straight), or aromatic (round/ ring) compounds joined by an O- oxygen molecule (essentially hydrocarbon compounds as well).


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PostPosted: Tue May 14, 2002 8:10 am 
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:idea: perhaps this will explain it futher/better

here are some links regarding epoxy:
http://www.psrc.usm.edu/macrog/epoxy.htm
http://www.netcomposites.com/education.asp?sequence=12


CA glue:
http://www.howstuffworks.com/question695.htm
http://lib.ru/STERLINGB/f_sf_07.txt


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