Articles :: Cooling Solution Giants: Agilent and Molex at the Intel Developers Forum :: Motherboards.org

Doc Overclock · 03-14-2001 · Category: Interviews

Molex Incorporated


Turning pennies into dollars is what Molex cooling solutions are doing. Made with a copper or aluminum core and well manufactured, these are very solid pieces of equipment. I got to handle a couple of these devices at the show, and they were quite nicely and sturdily built. These most definitely are not the usual schlock here. Molex is a huge corporation, and the Thermal division is just another cog on the giant Molex wheel, as they have a large variety of products that they manufacture for the computer industry.

Molex is the world's second-largest manufacturer of electronic, electrical and fiber optic interconnection products and systems. They also make a variety of switches and application tooling devices. See their Web site for a complete history. Molex is one big company and have been around since close to the turn of the previous century, so they have a lot of experience in the electronics field.

With 115 operations on six continents, Molex can design, manufacture and deliver products to any location around the world. They service their customers through their own sales engineers and a global network of authorized distributors that help service the entire world. I look forward to receiving and testing their cooling solutions so I can show some solid results to the readers out there. Then they will be familiar with the Molex name when thinking of cooling solutions for their system.

  • Light weight -Standard FC PGA heat sink weighs less than 100 grams
  • Simple snap-on clip with easy access thumb latch
  • Scaleable design - Use aluminum or copper center core -1", 1.125", or 1.25" diameter cores -Vary number of fins -Many different fan options available -Many different thermal interface materials available
  • Folded fins wrapped around center rod improves thermal efficiency -All fins close to heat source - All fins same distance from heat source
  • Improved system air flow -360 air flow -Pressurizing or evacuating
  • Plastic fin cap -Presses fins against center rod -Fan mounts to press fit pins -Directs air to fins
  • Low noise

Molex has released Radial Fin coolers for Intel's Celeron, Pentium III, and Pentium 4 microprocessors.

Cool microprocessors faster and more quietly with Radial Fin Heat Sinks from Molex Thermal Acoustic Products. Using Molex's patent pending radial folded fin design, these heat sinks enable 360 degrees air flow, providing higher volumetric efficiency than traditional extruded heat sinks. As a result, comparable microprocessor cooling is achieved with less air flow, reducing fan noise for quieter PCs. Molex manufactures Radial Fin Heat Sink models for use with SECC2 and PGA microprocessors in personal computers.

Weighing as little as 50% less than traditional heat sinks, the Radial Fin Heat Sink offers better mechanical shock and vibration design margins than most extruded heat sinks. It does not require heat sink supports to meet mechanical and vibration requirements. Full-system level testing of this heat sink shows that it has a CPU diode chassis ambient thermal resistance as low as 0.64 degrees C/W. These Molex Heat Sinks mount easily on the microprocessor socket with a spring clip that can be attached by hand.

Molex has released Radial Fin coolers for AMD's Duron and Athlon microprocessors.

Cool microprocessors faster and more quietly with Radial Fin Heat Sinks from Molex Thermal Acoustic Products. Using Molex's patent pending radial folded fin design, these heat sinks enable 360 degrees air flow, providing higher volumetric efficiency than traditional extruded heat sinks. As a result, comparable microprocessor cooling is achieved with less air flow, reducing fan noise for quieter PCs. Molex manufactures Radial Fin Heat Sink models for use with SECC2 and PGA microprocessors in personal computers.

Weighing as little as 50% less than traditional heat sinks, the Radial Fin Heat Sink offers better mechanical shock and vibration design margins than most extruded heat sinks. It does not require heat sink supports to meet mechanical and vibration requirements. Full-system level testing of this heat sink shows that it has a CPU diode chassis ambient thermal resistance as low as 0.64 degrees C/W. These Molex Heat Sinks mount easily on the microprocessor socket with a spring clip that can be attached by hand.

Contents

  1. Introduction
  2. Molex Incorporated
  3. Agilent Technologies